BGA Reballing and Robotic Hot Solder Dip Solutions



 

AS9100 and ISO 9001 Certified

Winslow Automation’s SolderQuik® BGA Reballing Preforms are available in 2 standard alloys:

  • Lead Free (SAC305 - Sn96.5/Ag3.0/Cu0.5)
  • Tin Lead (Sn63/Pb37)
if a custom alloy is required, contact Customer service for availability (408) 262-9004.