FOR IMMEDIATE RELEASE
announces volume ball attach service utilizing RVSI/Vanguard BGA Ball
San Jose, CA - July 15, 1998 - SIX SIGMA, a leading provider of
lead finish and BGA reballing services for the electronics industry,
announced today that it has purchased an RVSI/Vanguard Semi-Automated BGA
Ball Placement System.
The Vanguard machine will add significant capacity to SIX SIGMA’s
existing ball attach and BGA reballing production line. In it's BGA
reballing service, SIX SIGMA utilizes the FlexLine®
robotic tinning system to remove the solder left behind when the component
was removed from the board. The Vanguard will be utilized for ball
placement. Reflow and cleaning will be performed on in-line systems.
Together with the very flexible SolderQuikTM Preform methods
already in use, SIX SIGMA will be capable of handling significant variations
in lead count and volume requirements.
“Processing as many components as we do every week has made almost every
one of our dedicated employees into soldering experts. It is a natural
progression for us to apply our soldering expertise to a volume ball attach
service,” states Russ Winslow, President of SIX SIGMA.
SIX SIGMA, which began operations in 1990, provides hot solder
lead finish services and related testing for the semiconductor and printed
circuit board industries. Components processed by SIX SIGMA are in
applications that vary from the most sophisticated missile guidance systems,
to the engine controllers in commercial airlines, to automobile passive
restraint systems. Today, SIX SIGMA is a recognized leader in
semiconductor lead finish - processing millions of high-reliability
semiconductor components each year.