Lead-Free Solder Alloys in SolderQuik® BGA Preforms
Winslow Automation’s SolderQuik® BGA Reballing Preforms are
available in a Lead Free version that utilizes spheres composed of SAC305
(Sn96.5/Ag3.5/Cu0.5) alloy. The highlighted S, A,
and C are the root of the popular SAC acronym. This alloy complies with
the J-STD-006 requirements.
The selection of this alloy as Winslow Automation’s choice for inclusion in this
product line was driven by two factors: the vast majority of our lead-free
customers requested this alloy and it is currently the most popular lead-free
alloy used by semiconductor manufacturers.
We receive many requests for lead free alloy spheres that are similar to but not
an exact match with the SAC305 (Sn96.5/Ag3.0/Cu0.5) alloy that we stock.
Winslow Automation is committed to complying with customer call-outs whenever
possible. Due to minimum buy quantities and shelf life issues it is not possible
for us to stock every alloy offering. We recommend that applications of this
nature be reviewed for compatibility with common, popular alloys whenever
As always, Winslow Automation, Inc. will quote the use of custom alloys in its
products with the stipulation that additional charges may be incurred and lead
times can increase. It is our policy that orders involving custom alloys cannot