SolderQuik^® BGA Reballing Preform
Technical Specifications

Ball Dia.		Acceptable Pitch					Min. Offset	Solder Alloy		Body Size (Range)
mm	in.	1.27 mm	1.00 mm	0.80 mm	0.65 mm	0.50 mm	mm	Pb Free	Pb	mm
0.762	0.030						0.90	Sn96.5- Ag3- Cu0.5*	Sn63- Pb37	3.5 by 3.5 to 85 by 85
0.635	0.025						0.90
0.610	0.024						0.80
0.559	0.022						0.80
0.508	0.020						0.75
0.457	0.018						0.75
0.381	0.015						0.65
0.330	0.013						0.65

* Our Pb Free composition is known as SAC305