SolderQuik® BGA Reballing Starter Kit
	The SolderQuik® Reballing Starter Kit is the perfect solution for low volume BGA reballing. Ideally suited for labs and prototyping, the kit contains many items needed to get started literally right out of the box and easily fits into your current processing environment.
	The SolderQuik® BGA Reballing Starter Kit is housed in a black plastic carrying case and includes:
	One package (25 identical preforms) of SolderQuik® BGA Reballing Preforms of your choice Alignment Fixture to match the chosen preform BGA Reballing Quick Guide Comprehensive instruction manual detailing everything from deballing to reballing including bake and dry packaging and profiling your reflow equipment		Flux syringe of WS-609 Flux (MSDS for WS-609) One (1) 250ml bottle with flip top lid for easy dispensing of de-ionized water Cleaning tray Other small tools and supplies needed in the process including tweezers, ESD cleaning brush, acid brushes, desoldering braid, conductive mat, and IPA wipes MSDS sheets
	The Customer will need to have the following on hand:
	Oven recommended for moisture removing bake Soldering iron or some other tool for removing residual solder such as the Model 237 Wave Solder Pot Hot air reflow system, convection oven, or conveyor reflow oven Deionized Water Soaking beaker for cleaning fixtures Microscope (optional for inspection)