BGA Reballing and Robotic Hot Solder Dip Solutions


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Previous Press Releases

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October 10, 2008 WINSLOW AUTOMATION Achieves AS9100 and ISO9001:2000 Certification
Dale Albright, Milpitas, CA
October 6, 2008 SIX SIGMA Achieves Transitional QML Certification
Dale Albright, Milpitas, CA
December 9, 2006 WINSLOW AUTOMATION, Inc. Celebrates 20 years in business
Dale Albright, Milpitas, CA
April 25, 2006 Winslow Automation releases its Ecommerce Site for buying preforms
Winslow Automation, Milpitas, CA
June 21, 2002 SIX SIGMA announces relocation to new facilities
Dale Albright, Milpitas, CA
July 18, 2001 SIX SIGMA wins the 2001 Advanced Packaging Award for its Column Attach Services. (pdf)
Posting from Advanced Packaging Award
January 19, 2000 Winslow Automation Introduces Lead-Free Solder Sphere
SolderQuik™ Preforms for BGA Reballing.

Matt Mazdeh, San Jose, CA
July 28, 1999 BGA Rework Seminar
Dale Albright, San Jose, CA
1998 SMT Vision Award (pdf)
August 25, 1998 Winslow Automation, Inc. Awarded 1998 SMT Vision Awards Rework and Repair Product of the Year for their SolderQuik® BGA Preform
Daryl Sawtelle, Winslow Automation, San Jose, CA
July 15, 1998 SIX SIGMA announces Volume Ball Attach Service Uutilizing RVSI/Vanguard BGA Ball Placement System.
Daryl Sawtelle, San Jose, CA
February 23, 1996 Winslow Automation Acquires The Rights To SolderQuik® Product Line From Raychem
Spencer Sias, Raychem, Menlo Park, CA
February 14, 1996 Winslow Automation acquires SolderQuik™ business from Raychem Corp.
Jennifer Cortez, Santa Clara, CA

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