Winslow Automation has been advancing lead finish and soldering technology
since 1986. In 1990, Winslow Automation expanded to include a service division
known as SIX SIGMA
utilizing the Winslow Automation Flexline®, a computerized robotic
lead tinning machine capable of processing a variety of components.
SIX SIGMA has become the premier lead finish subcontractor
in the nation processing millions of components annually. In 1994, Winslow Automation
expanded its soldering equipment line with the asset purchase of Mechanization
Associates. In 1996, Winslow Automation acquired Raychem Corporation's SolderQuik®
Products as a natural extension to our soldering technology product base.
SIX SIGMA added BGA reballing services utilizing the
SolderQuik® technology in 1997 and has since processed thousands
of BGA components.
Patented by Raychem, the SolderQuik® BGA Reballing
Preform is the fast, simple, cost effective solution for all low volume
ball attach and reballing needs. The SolderQuik® BGA
Reballing Starter Kit provides essential tools and supplies needed to
launch this solution on your production line, in your lab, or at remote
sites. The Model 237 Solder Pot complements the
kit for your de-balling needs.
Winslow Automation also offers legacy products in our SolderQuik® consumables
line to meet your component ruggedization and fine pitch to PCB rework needs
with SolderQuik® Chip Carrier Mounting Device (CCMD)
and SolderQuik® Tape respectively.
Winslow Automation’s soldering equipment line features the
FlexLine™ Robotic Hot Solder Dip Module for those
needing the capability of processing a large volume and variety of multiple
components through a repeatable and robotic hot solder dip process. It is
complemented by our Fine Pitch Lead Tinning Flux
which is formulated to prevent icicles and bridging between leads when soldering
fine pitch components.
With a diverse product selection and
services, we continue to lead
the way in providing superior BGA reballing solutions and other microelectronic
The proliferation of SMT technology in circuit assemblies created a need
to provide lead tinning of SMT components that could not be adapted to pallets
or other methods of automated soldering. Winslow recognized this need which
led to the development of the FlexLine® Lead Tinning System.
In 1996 Winslow Automation, Inc. acquired an exclusive license to Raychem's
SolderQuik® line, again adding to the Winslow Automation, Inc. products.
These products include SolderQuik® BGA (Ball Grid Array) preforms
that let you attach or reattach solder balls to packages, SolderQuik®
Tape which provides an accurate soldering strip that lets you routinely perform
fine-pitch surface-mount soldering on a wide variety of components as well as
ribbon cable mounting to PCB's, and SolderQuik® CCMD (Chip Carrier
Mounting Device) which provides a way to attach leadless ceramic chips to printed
wiring boards or for Column Grid Arrays.