BGA Reballing and Robotic Hot Solder Dip Solutions


AS9100C and ISO 9001:2008 Certified

Fast, Easy, Cost-Effective Solution for BGA Reballing, low-volume ball attach, or alloy conversion for RoHS compliance.

Winslow Automation has been advancing lead finish and soldering technology for the military and aerospace, telecommunications, medical, and consumer electronics industry since its inception in 1986.  Winslow Automation's soldering solutions for electronic component solder application and repair includes consumables as well as equipment.

Order your BGA Preforms!

Most orders ship within one (1) business day.
(Delivery time for orders over 100 pieces are subject to factory load)

BGA Reballing Solutions

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October 2009

Press Release: Winslow Automation Achieves AS9100 and ISO 9001:2008 Certification

October 2009

Press Release: SIX SIGMA Achieves AS9100 and ISO 9001:2008 Certification